45208-520200

3M Electronic Solutions Division
517-45208-520200
45208-520200

Mfr.:

Description:
Headers & Wire Housings 8P, .050" Pitch HDR R/A, TH, FLSH, LTCH

ECAD Model:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 192   Multiples: 192
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$3.96 $760.32
$3.90 $2,246.40
$3.82 $4,400.64
$3.79 $10,187.52

Product Attribute Attribute Value Select Attribute
3M
Product Category: Headers & Wire Housings
RoHS:  
Headers
Shrouded
8 Position
1.27 mm (0.05 in)
2 Row
Solder Pin
Pin (Male)
Gold
452
- 55 C
+ 105 C
Each
Brand: 3M Electronic Solutions Division
Contact Material: Phosphor Bronze
Contact Type: Pin
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: VN
Current Rating: 1 A
Flammability Rating: UL 94 V-0
Housing Material: Liquid Crystal Polymer (LCP)
Latching Type: Latched
Product Type: Headers & Wire Housings
Factory Pack Quantity: 192
Subcategory: Headers & Wire Housings
Voltage Rating: 125 V
Part # Aliases: 7100243466
Unit Weight: 1.701 g
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CNHTS:
8538900000
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

452 Series 1.27mm Shrouded Boardmount Headers

3M 452 Series 1.27mm (0.050") Shrouded Boardmount Headers are compact, robust mating connectors in a fine-pitch system allowing high connection density in a small space. A shroud or four-wall box protects two rows of copper alloy pins spaced 1.27mm apart. 30μ" gold and gold flash plating options are available on the wiping area for multiple mating/unmating cycles and price points according to engineering requirements and budget. Optional latches on the 3M 452 Shrouded Boardmount Headers provide a mechanical means to secure the mating socket connector during use or remove it for maintenance or repair. Designers can select from vertical or right-angle versions with thru-hole solder tails. Gull-wing solder tails are offered for surface-mount processing and tape and reel packaging to enable high-volume manufacturing.