cExpress-SL-i5-6300U

ADLINK Technology
976-CEXP-SL-I5-6300U
cExpress-SL-i5-6300U

Mfr.:

Description:
Computer-On-Modules - COM cExpress-SL-i5-6300UCompact COM Express Type 6 module with Intel i5-6300U with GT2 level graphics

Datasheet:
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Learn more about ADLINK Technology cExpress-SL-i5-6300U

Availability

Stock:
Non-Stocked
Factory Lead Time:
30 Weeks Estimated factory production time.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$1,060.73 $1,060.73
$998.84 $9,988.40

Product Attribute Attribute Value Select Attribute
ADLINK Technology
Product Category: Computer-On-Modules - COM
RoHS:  
COM Express Compact Type 6
Brand: ADLINK Technology
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Product Type: Computer-On-Modules - COM
Series: cExpress-SL
Factory Pack Quantity: 1
Subcategory: Computing
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Datasheet

PCN

Express-SL/SLE COM

ADLINK Express-SL/SLE is a COM.0 R2.1 Basic Size Type 6 computer-on-module supporting the 64-bit 6th Generation Intel® Core™, Xeon® E3, and Celeron® processors (formerly "Skylake-H") with Intel® QM170, HM170, CM236 Chipset. The Express-SL/SLE provides outstanding, high-performance graphics processing, reduced development time, and long-lifecycle support. The device features Intel Hyper-Threading Technology (up to 4 cores, 8 threads) and DDR4 dual-channel memory at 1866/2133MHz with ECC/non-ECC support determined by CPU/chipset combination. This combination ensures the excellent overall performance of the module. High-speed connectivity of the CPU to the Intel QM170, HM170, CM236 Chipset is supported through an Intel Flexible Display Interface and Direct Media Interface.

COM Express Modules

ADLINK Technology has announced COM Express computer-on-modules (COMs) based on the 6th generation Intel Core i7/i5/i3 processors and latest Xeon processors. These modules follow the form, fit, function design principle for optimum flexibility in upgrading and application scalability, enabling accelerated development and faster time-to-market for embedded applications.

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