ATS-HP-F5L250S15W-219

Advanced Thermal Solutions
984-HPF5L250S15W219
ATS-HP-F5L250S15W-219

Mfr.:

Description:
Liquid Cold Plates, Liquid Cooling & Heat Pipes Heat Pipe, Copper, High Performance, Flat, Sintered, Distilled H2O, 250x6.44x3mm

Datasheet:
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In Stock: 32

Stock:
32 Can Dispatch Immediately
Factory Lead Time:
12 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$15.80 $15.80
$13.41 $134.10
$13.30 $266.00
$12.47 $623.50
$11.88 $1,188.00
$11.30 $2,260.00
$11.08 $5,540.00
2,000 Quote

Product Attribute Attribute Value Select Attribute
Advanced Thermal Solutions
Product Category: Liquid Cold Plates, Liquid Cooling & Heat Pipes
RoHS:  
Heatpipes
Flat Heat Pipe
Copper
250 mm
6.44 mm
3 mm
Brand: Advanced Thermal Solutions
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Height - in: 0.11
Height - mm: 3
Length - in: 9.92
Length - mm: 252
Packaging: Tray
Product Type: Heat Sinks
Series: ATS-HP-F
Factory Pack Quantity: 10
Subcategory: Heat Sinks
Width - in: 0.25
Width - mm: 6.44
Products found:
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Attributes selected: 0

USHTS:
7411105000
JPHTS:
741110000
KRHTS:
7411100000
ECCN:
EAR99

High-Performance Round & Flat Heat Pipes

Advanced Thermal Solutions (ATS) High-Performance Round and Flat Heat Pipes are used to transfer heat with minimal temperature difference or to spread heat across a surface. These heat pipes are low profile, lightweight, and attach easily to a heat sink. Heat pipes are self-driven, two-phase devices. At the hot end (evaporator) the liquid evaporates and turns to vapor. This vapor flows to the cold end (condenser) where it is liquified. The liquid is driven back from the cold end to the hot end by capillary forces within the heat pipe's wick structure. These heat pipes are available with grooved or sintered copper powder wick structures. ATS High-Performance Round and Flat Heat Pipes are widely used in aerospace applications, military devices, temperature control systems, and personal computers.

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