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ATS012012011-SF-2J

Name: Advanced Thermal Solutions ATS012012011-SF-2J
Brand: Advanced Thermal Solutions
SKU: 984-ATS012012011SF2J
Price: 4.04 USD
Availability: InStock

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Mouser No:

984-ATS012012011SF2J

Mfr. No:

ATS012012011-SF-2J

Mfr.:

Advanced Thermal Solutions

Description:

Heat Sinks BGA Heat Sink, High Aspect Ratio Extrusion, Straight, No TIM, 12x12x11mm

Datasheet:

ATS012012011-SF-2J Datasheet (PDF)

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Learn more about Advanced Thermal Solutions ATS012012011-SF-2J

In Stock: 79

Stock:: 79 Can Dispatch Immediately

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$4.04	$4.04
	$3.79	$37.90
	$3.69	$73.80
	$3.49	$174.50
	$3.28	$328.00
	$3.08	$616.00
	$2.97	$1,485.00
	$2.80	$2,800.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Advanced Thermal Solutions
Product Category:	Heat Sinks
RoHS:
Product:	Heat Sinks
Designed for:	BGA
Mounting Style:	PCB
Heatsink Material:	Aluminum
Fin Style:	Straight Fin
Thermal Resistance:	21.39 C/W
Length:	12 mm
Width:	12 mm
Height:	11 mm
Brand:	Advanced Thermal Solutions
Color:	Black
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Packaging:	Bulk
Product Type:	Heat Sinks
Series:	BGA High Aspect Ratio
Factory Pack Quantity:	100
Subcategory:	Heat Sinks
Tradename:	Value-Line Platform
Type:	Component

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Datasheet

ATS012012011-SF-2J Datasheet (PDF)

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CAHTS:: 8542900000
USHTS:: 8542900000
JPHTS:: 854290000
TARIC:: 8542900000
MXHTS:: 8542900100
ECCN:: EAR99

Straight Fin Value-Line Heat Sinks

Advanced Thermal Solutions Straight Fin Value-Line Heat Sinks are high-performance heat sinks with high aspect ratios and are ideal for compact PCB environments. These heat sinks are available for component sizes 10mm x 10mm to 60mm x 60mm with height ranges from 2mm to 25mm with 1mm increments. The straight fin value-line heat sinks can be attached to the devices with double-sided thermal adhesives, Z-clip, or maxiGRIP™ technologies. The higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks. The straight fin design offers an excellent cooling solution for spatially constrained PCB layouts. These straight-fin heat sinks can be applied to various components, including Altera^®, AMD, Freescale, Intel^®, TI, and Xilinx.

BGA - High Aspect Ratio Value-Line Heat Sinks

Advanced Thermal Solutions BGA - High Aspect Ratio Value-Line Heat Sinks are offered in pin fin, straight fin, and slant fin profiles. These high-performance heat sinks ensure reliable product life at a lower cost than other extruded heat sinks. The high aspect ratio value-line heat sinks come in industry-standard footprints ranging from 10mm x 10mm to 60mm x 60mm. The extruded aluminum minimizes thermal resistance, reduces weight, and keeps costs low. The Slant fin heat sinks feature a low-profile, slant fin array that offers many benefits of maxiFLOW™ at a great value.