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627-11W1224-1N1

Name: EDAC 627-11W1224-1N1
Brand: EDAC
SKU: 587-627-11W1224-1N1
Price: 5.57 USD
Availability: InStock

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Mouser No:

587-627-11W1224-1N1

Mfr. No:

627-11W1224-1N1

Mfr.:

EDAC

Description:

D-Sub Mixed Contact Connectors 627 Series vertical Combo' D-Sub plug connector, 11W1 layout, gold flash plating, PCB tails, nickel plated shell

Datasheet:

627-11W1224-1N1 Datasheet

ECAD Model:

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More Information

Learn more about EDAC 627-11W1224-1N1

In Stock: 250

Stock:: 250 Can Dispatch Immediately

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Factory Lead Time:: 12 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$5.57	$5.57
	$4.73	$47.30
	$4.43	$110.75
	$4.22	$211.00
	$4.02	$402.00
	$3.72	$930.00
	$3.59	$1,795.00
	$3.41	$3,410.00
	$3.23	$8,075.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	EDAC
Product Category:	D-Sub Mixed Contact Connectors
REACH - SVHC:
Contact Arrangement:	11W1
Number of Positions:	11 Position
Mounting Style:	Through Hole
Mounting Angle:	Vertical
Termination Style:	Solder Cup
Brand:	EDAC
Contact Material:	Copper
Contact Plating:	Gold
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	TW
Current Rating:	10 A
Filtered:	Unfiltered
Gender:	Male
Insulation:	Insulated
Insulation Material:	Thermoplastic Polyester
Maximum Operating Temperature:	+ 125 C
Minimum Operating Temperature:	- 55 C
Product Type:	Mixed Contact D-Sub Connectors
Series:	627
Shell Material:	Steel
Shell Plating:	Nickel
Factory Pack Quantity:	1
Subcategory:	D-Sub Connectors
Voltage Rating:	125 V

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Attributes selected: 0

Filter Document:

USHTS:: 8536694040
TARIC:: 8536693000
ECCN:: EAR99

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EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.

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