0603AS-082J-01

Fastron
434-0603AS-082J-01
0603AS-082J-01

Mfr.:

Description:
RF Inductors - SMD Ceramic Core Chip Inductor

Datasheet:
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In Stock: 767

Stock:
767 Can Dispatch Immediately
Factory Lead Time:
9 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (USD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$0.334 $0.33
$0.279 $2.79
$0.259 $6.48
$0.20 $20.00
$0.19 $47.50
$0.147 $147.00
$0.131 $327.50
Full Reel (Order in multiples of 4000)
$0.12 $480.00
$0.112 $896.00
† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Fastron
Product Category: RF Inductors - SMD
RoHS:  
Wirewound
0603 (1608 metric)
Unshielded
82 nH
5 %
400 mA
540 mOhms
- 40 C
+ 150 C
34
1.7 GHz
Standard
1.7 mm
1.1 mm
1 mm
Ceramic
AEC-Q200
0603AS
Reel
Cut Tape
MouseReel
Application: RF
Brand: Fastron
Case Code - in: 0603
Case Code - mm: 1608
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MY
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 4000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Unit Weight: 3.200 mg
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Attributes selected: 0

Datasheet

Application Notes

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CNHTS:
8504500000
USHTS:
8504508000
TARIC:
8504509590
ECCN:
EAR99

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

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