0603AS-R10J-08

Fastron
434-0603AS-R10J-08
0603AS-R10J-08

Mfr.:

Description:
RF Inductors - SMD 100nH 150 MHz 5% Tol

Datasheet:
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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 1000)

Pricing (USD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$0.42 $0.42
$0.354 $3.54
$0.328 $8.20
$0.253 $25.30
$0.147 $36.75
Full Reel (Order in multiples of 1000)
$0.124 $124.00
† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
Fastron
Product Category: RF Inductors - SMD
RoHS:  
Wirewound
0603 (1608 metric)
Unshielded
100 nH
5 %
400 mA
580 mOhms
- 40 C
+ 150 C
34
1.4 GHz
Standard
1.7 mm
1.1 mm
1 mm
Ceramic
AEC-Q200
0603AS
Reel
Cut Tape
MouseReel
Application: RF
Brand: Fastron
Case Code - in: 0603
Case Code - mm: 1608
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MY
Mounting Style: PCB Mount
Product: RF Inductors
Product Type: RF Inductors - Leaded
Factory Pack Quantity: 1000
Subcategory: Inductors, Chokes & Coils
Termination Style: SMD/SMT
Test Frequency: 150 MHz
Unit Weight: 3.200 mg
Products found:
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Attributes selected: 0

Datasheet

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CNHTS:
8504500000
CAHTS:
8504500000
USHTS:
8504508000
JPHTS:
8504500001
KRHTS:
8504509090
TARIC:
8504509590
MXHTS:
8504509102
BRHTS:
85045000
ECCN:
EAR99

RF Chip Inductors

Fastron RF Chip Inductors feature a ceramic core and are designed for RF applications that require optimal Q on high-frequency circuits. Fastron RF chip inductors feature gold flash pad metallization to provide better solderability for a higher yield in production, and the encapsulation not only protects the winding but also allows surface mount assembly. Case sizes are available in 0402, 0603, 0805, 1008, 1206, and 1210 with an operating temperature range from -40°C to +125°C. Applications include mobile telecommunication, automotive subsystems, and wireless communication.

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