C2220X303KZRLCAUTO

KEMET
80-C2220X303KZRLAUTO
C2220X303KZRLCAUTO

Mfr.:

Description:
Multilayer Ceramic Capacitors MLCC - SMD/SMT 2500V .030uF X7R 2220 10% AEC-Q200
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Datasheet:
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Availability

Stock:
0

You can still purchase this product for backorder.

Factory Lead Time:
14 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 300)

Pricing (USD)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
$4.14 $4.14
$2.90 $29.00
$2.51 $125.50
$2.49 $249.00
Full Reel (Order in multiples of 300)
$2.36 $708.00
$2.27 $2,043.00
$2.19 $3,942.00
† A MouseReel™ fee of $7.00 will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Similar Products

Product Attribute Attribute Value Select Attribute
KEMET
Product Category: Multilayer Ceramic Capacitors MLCC - SMD/SMT
RoHS:  
0.03 uF
2.5 kVDC
X7R
10 %
2220
5650
SMD/SMT
Flexible (Soft)
- 55 C
+ 125 C
5.9 mm (0.232 in)
5 mm (0.197 in)
5.1 mm (0.201 in)
Automotive Grade MLCCs
AEC-Q200
KONNEKT Auto X7R
Reel
Cut Tape
MouseReel
Brand: KEMET
Class: Class 2
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: MX
Package/Case: 2220 (5650 metric)
Product Type: Ceramic Capacitors
Factory Pack Quantity: 300
Subcategory: Capacitors
Tradename: KONNEKT
Type: X7R Dielectric Automotive Grade MLCC
Unit Weight: 620 mg
Products found:
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Attributes selected: 0

Datasheet

KSIM

Models

PCN

Specification Sheets

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CNHTS:
8532241000
CAHTS:
8532240010
USHTS:
8532240020
JPHTS:
853224000
KRHTS:
8532240000
TARIC:
8532240000
MXHTS:
8532240400
BRHTS:
85322410
ECCN:
EAR99

KONNEKT™ High-Density Packaging Technology

KEMET KONNEKT™ High-Density Packaging Technology enables components to be bonded together without the use of metal frames, reducing with it the ESR, ESL, and thermal resistance to capacitors. The KEMET KONNEKT technology utilizes innovative transient liquid phase sintering (TLPS) material. The TLPS material has a low-temperature reaction of low melting point metal or alloy, with a high melting point metal or alloy, to form a reacted metal matrix. This process results in a highly conductive bonding material that can be used to connect multiple MLCCs together to form a single surface-mountable component.

X7R Capacitors with KONNEKT™ Technology

KEMET X7R Capacitors with KONNEKT™ Technology feature a 2.4nF to 20µF capacitance range and 25VDC to 3kVDC voltage rating in EIA 1812 or 2220 package sizes. The KONNEKT high-density packaging technology offers an innovative transient liquid phase sintering (TLPS) material that creates a surface-mount, multi-chip solution for high-density packaging. These capacitors are considered temperature stable due to the 125°C maximum operating temperature and are characterized as a Class II material by the EIA. These fixed, ceramic dielectric capacitors are suited for bypass and decoupling applications or for frequency-discriminating circuits where Q and stability of capacitance characteristics are not critical. The X7R boasts a minimal change in capacitance with reference to ambient temperature and the capacitance change is limited to ±15% from -55°C to +125°C.

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