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A10538-18

Name: Laird Technologies A10538-18
Brand: Laird Technologies
SKU: 739-A10538-18
Price: 250.49 USD
Availability: OutOfStock

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Mouser No:

739-A10538-18

Mfr. No:

A10538-18

Mfr.:

Laird Technologies

Description:

Thermal Interface Products Tputty 502 20 FG2 18x18" 3W/mK XSoft

Datasheet:

A10538-18 Datasheet (PDF)

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Availability

Stock:: Non-Stocked

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Factory Lead Time:: 10 Weeks Estimated factory production time.

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Minimum: 4 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

This Product Ships FREE

Pricing (USD)

Qty.	Unit Price	Ext. Price
	$250.49	$1,001.96
	$249.71	$2,497.10
	$249.65	$6,241.25

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Laird Technologies
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Thermal Conductivity:	3 W/m-K
Series:	Tputty 502
Packaging:	Bulk
Brand:	Laird Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Tradename:	Tputty

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Datasheet

A10538-18 Datasheet (PDF)

CAHTS:: 8546900090
USHTS:: 3919905060
KRHTS:: 3919900000
MXHTS:: 3919909900
ECCN:: EAR99

TPutty™ Gap Fillers

Laird Technologies TPutty™ Gap Fillers are soft, low-abrasive, silicone-based thermal gap fillers ideal for applications where large or uneven gap tolerances are present. Gap filler is used to bridge the interface between hot components and a chassis or heat sink assembly when the elimination of mechanical stress or bulk dispensing are critical design considerations. The material allows for the transfer of little to no pressure on mating parts. With a UL 94V-0 flammability rating, Laird Technologies TPutty™ Gap Fillers provide excellent thermal performance and compliance.

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.