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A17819-07

Name: Laird Technologies A17819-07
Brand: Laird Technologies
SKU: 739-A17819-07
Price: 796.25 USD
Availability: OutOfStock

Mouser No:

739-A17819-07

Mfr. No:

A17819-07

Mfr.:

Laird Technologies

Description:

Thermal Interface Products Tflex HD91750,DC1 18x18IN,

Datasheet:

A17819-07 Datasheet (PDF)

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$796.25	$796.25
	$743.12	$7,431.20

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Laird Technologies
Product Category:	Thermal Interface Products
Product:	Gap Fillers / Gap Pads / Sheets
Package/Case:	Non-standard
Material:	Silicone Elastomer
Thermal Conductivity:	7.5 W/m-K
Color:	Gray
Minimum Operating Temperature:	- 50 C
Maximum Operating Temperature:	+ 125 C
Length:	1.5 ft
Width:	1.5 ft
Thickness:	0.07 in
Flammability Rating:	UL 94 V-0
Series:	HD90000
Packaging:	Bulk
Brand:	Laird Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Thermal Interface Products
Factory Pack Quantity:	1
Subcategory:	Thermal Management
Tradename:	Tflex

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Datasheet

A17819-07 Datasheet (PDF)

USHTS:: 3919905060
KRHTS:: 3919900000
TARIC:: 8546901000
MXHTS:: 3919909900
ECCN:: EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Tflex™ HD90000 Thermal Gap Filler

Laird Technologies Tflex™ HD90000 Thermal Gap Filler features a combination of 7.5W/mK thermal conductivity with superior pressure vs. deflection characteristics. This silicone-based thermal gap filler minimizes board and component stress. The ceramic-filled silicon sheets are offered in a variety of thicknesses ranging from 0.020" to 0.200". Laird Technologies Tflex™ HD90000 Thermal Gap Filler is an environmentally friendly solution that meets regulatory requirements, including RoHS and REACH.