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A18330-18

Name: Laird Technologies A18330-18
Brand: Laird Technologies
SKU: 739-A18330-18
Price: 189.66 USD
Availability: OutOfStock

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Mouser No:

739-A18330-18

Mfr. No:

A18330-18

Mfr.:

Laird Technologies

Description:

Thermal Interface Products 4.50 127x76mm

Datasheet:

A18330-18 Datasheet

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Learn more about Laird Technologies A18330-18

Availability

Stock:: Non-Stocked

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Factory Lead Time:: 10 Weeks Estimated factory production time.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$189.66	$758.64
	$187.77	$2,253.24
	$184.32	$4,976.64
	$183.23	$9,344.73
102	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Laird Technologies
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Package/Case:	Non-standard
Length:	127 mm
Width:	76 mm
Thickness:	4.5 mm
Series:	HP34
Packaging:	Bulk
Brand:	Laird Technologies
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Product Type:	Thermal Interface Products
Factory Pack Quantity:	3
Subcategory:	Thermal Management
Tradename:	Tflex

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Datasheet

A18330-18 Datasheet

USHTS:: 6815190000
ECCN:: EAR99

Thermal Interface Solutions

Laird Technologies Thermal Interface Solutions are designed to meet the challenges of today's electronics, which are smaller but more powerful. Laird TIM products are engineered to fill in air gaps and microscopic irregularities to help deliver more efficient cooling.

Tflex™ HP34 Thermal Gap Filler

Laird Technologies Tflex™ HP34 Thermal Gap Filler is a silicone-free, high-performance gap filler made of aligned graphite fibers that provide an alternative to messy grease gap fillers. The graphite fibers are aligned to provide high bulk thermal conductivity of 34W/mK. In addition, the Tflex HP34 series is designed to maintain its thermal performance within an application under increased pressure. The ideal performance will occur in the lower pressure range of 10psi to 30psi. Laird Technologies Tflex HP34 Thermal Gap Filler also offers low contact resistance to the mating surfaces.