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TGN1300-01180118-010-1PC

Name: LeaderTech TGN1300-01180118-010-1PC
Brand: LeaderTech
SKU: 861-TGN1300118011810
Price: 86.59 USD
Availability: InStock

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Mouser No:

861-TGN1300118011810

Mfr. No:

TGN1300-01180118-010-1PC

Mfr.:

LeaderTech

Description:

Thermal Interface Products Thermally Conductive Graphene, 130 W/m-K, 1.18"x1.18"x0.01"

Datasheet:

TGN1300-01180118-010-1PC Datasheet (PDF)

ECAD Model:

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More Information

Learn more about LeaderTech TGN1300-01180118-010-1PC

In Stock: 256

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Ext. Price:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$86.59	$86.59
	$81.51	$815.10
	$76.41	$1,528.20
	$73.70	$3,685.00
	$65.98	$6,598.00
	$64.96	$12,992.00
500	Quote

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	LeaderTech
Product Category:	Thermal Interface Products
RoHS:
Product:	Gap Fillers / Gap Pads / Sheets
Type:	Ultra-Thin Thermal Pad
Package/Case:	Non-standard
Thermal Conductivity:	130 W/m-K
Color:	Black
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 150 C
Length:	29.97 mm
Width:	29.97 mm
Tensile Strength:	0.05 MPa
Series:	TGN
Packaging:	Bulk
Brand:	LeaderTech
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Height:	0.254 mm
Product Type:	Thermal Interface Products
Factory Pack Quantity:	100
Subcategory:	Thermal Management

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Datasheet

TGN1300-01180118-010-1PC Datasheet (PDF)

USHTS:: 3921905050
ECCN:: EAR99

TGN Ultra-Thin Thermal Pads

LeaderTech TGN Ultra-Thin Thermal Pads feature low thermal resistance and are manufactured by combining graphene and silicone. These materials are arranged in the polymer matrix in a precise manner, forming a good thermally conductive path that significantly improves the efficiency of heat conduction. The TGN series offers a -40°C to +150°C operating temperature range and a short-term operating temperature of +260°C for 30 minutes. LeaderTech TGN Ultra-Thin Thermal Pads have high resiliency and low density, making them suitable for the replacement of thermal grease material. Applications include graphic processors, base stations, microprocessors and telecommunications.