G-Link-200-OEM-8G CE Version

MicroStrain by HBK
130-GLINK200OEM8GCE
G-Link-200-OEM-8G CE Version

Mfr.:

Description:
Acceleration Sensor Modules CE Version Accelerometers G-Link-200-OEM-8G, OB chip antenna, OEM wireless, high-speed triaxial accelerometer node, adjustable for +/-2G, +/-4G or +/-8G measure range. 2.4 GHz IEEE 802.15.4 radio. INCLUDES OB ANTENNA. NOT CERTIFIED FOR U.S OR JAPAN

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Availability

Stock:
Non-Stocked
Factory Lead Time:
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:
This Product Ships FREE

Pricing (USD)

Qty. Unit Price
Ext. Price
$850.37 $850.37
$831.12 $4,155.60
$815.10 $8,151.00

Product Attribute Attribute Value Select Attribute
MicroStrain by HBK
Product Category: Acceleration Sensor Modules
X, Y, Z
Digital
+ 85 C
Brand: MicroStrain by HBK
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: US
Minimum Operating Temperature: - 40 C
Mounting Style: Chassis Mount
Operating Supply Current: 45 mA
Product Type: Acceleration Sensor Modules
Sensor Type: 3-axis
Series: G-Link-200-OEM
Factory Pack Quantity: 1
Subcategory: Sensor Modules
Supply Voltage - Max: 36 V
Supply Voltage - Min: 3.3 V
Part # Aliases: 6305-6002-CE
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G-Link-200-OEM Wireless Accelerometer Nodes

MicroStrain by HBK G-Link-200-OEM Embeddable Wireless Accelerometer Nodes feature an onboard triaxial accelerometer that allows high-resolution data acquisition with extremely low noise and drift. Derived vibration parameters allow for long-term monitoring of key performance indicators while maximizing battery life. The G-Link-200-OEM embeddable wireless accelerometer nodes enable simultaneous, high-speed sensing and data aggregation from scalable sensor networks. MicroStrain's wireless sensing systems are ideal for test and measurement, remote monitoring, system performance analysis, and embedded applications.