170415-1122

Name: Molex 170415-1122
Brand: Molex
SKU: 538-170415-1122
Price: 19.72 USD
Availability: OutOfStock

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Mouser No:

538-170415-1122

Mfr. No:

170415-1122

Mfr.:

Molex

Description:

High Speed/Modular Connectors Impact 100 22mm Mezz 3x10 Open Sn

Datasheet:

170415-1122 Datasheet

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Availability

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$19.72	$19.72
	$17.10	$171.00
	$16.21	$405.25
	$15.97	$798.50
	$15.82	$1,582.00
	$15.76	$7,060.48

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	High Speed/Modular Connectors
RoHS:
Product:	Headers
Number of Positions:	90 Position
Number of Rows:	9 Row
Pitch:	1.9 mm
Termination Style:	Press Fit
Contact Plating:	Gold
Series:	170415
Packaging:	Tray
Brand:	Molex
Contact Material:	Tin
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	SG
Current Rating:	750 mA
Maximum Operating Temperature:	+ 85 C
Minimum Operating Temperature:	- 55 C
Mounting Angle:	Vertical
Product Type:	High Speed / Modular Connectors
Factory Pack Quantity:	224
Subcategory:	Backplane Connectors
Tradename:	Impact
Voltage Rating:	30 V
Unit Weight:	20.040 g

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Attributes selected: 0

Filter Document:

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Impact Backplane Connector System

Molex Impact Backplane System features data rates up to and beyond 25Gbps plus superior signal density of up to 30 pairs per cm. This system pushes the density envelope to meet next generation high-speed demands with one of the most versatile offerings in the market. Molex Impact Backplane System has a simple 1.90mm by 1.35mm grid that provides PCB routing flexibility.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.