171224-2011

Molex
538-171224-2011
171224-2011

Mfr.:

Description:
I/O Connectors zSFP+ Stacked, 2X2 W/Metal, w/ 4 LP

Datasheet:
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Learn more about Molex 171224-2011

In Stock: 61

Stock:
61 Can Dispatch Immediately
Factory Lead Time:
13 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 61 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$73.36 $73.36
$65.42 $654.20
$62.90 $1,572.50
$59.22 $2,961.00
$57.74 $4,157.28

Product Attribute Attribute Value Select Attribute
Molex
Product Category: I/O Connectors
RoHS:  
Receptacles
Jack (Female)
80 Position
0.8 mm
30 VAC
Gold
Panel Mount
Through Hole
Right Angle
171224
- 40 C
+ 85 C
Brand: Molex
Color: Black
Contact Material: Copper Alloy
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: ID
Current Rating: 500 mA
Features: Stacked Ganged Assembly with Metal Spring Fingers, with 4 light pipes
Flammability Rating: UL 94 V-0
Housing Material: Thermoplastic (TP)
Number of Ports: 4 Port
Product Type: I/O Connectors
Factory Pack Quantity: 72
Subcategory: I/O Connectors
Unit Weight: 51.084 g
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Attributes selected: 0

Datasheet

Application Notes

Models

Specification Sheets

Technical Resources

CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
BRHTS:
85366990
ECCN:
EAR99

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.

zSFP+ Interconnect Solution

Molex zSFP+™ Interconnect Solution delivers unparalleled signal integrity with superior EMI protection for next-generation Ethernet and Fibre Channel applications. The innovative design provides excellent thermal management without adding unnecessary materials or costs. The zSFP+ Interconnect Solution features a stacked design that delivers maximum thermal efficiency while providing excellent signal integrity and Electromagnetic Interference (EMI) protection. Both an enhanced airflow version for applications that require light pipes and a thru-flow design which opens up the midsection to take advantage of front-to-back airflow are available. This design allows heat to be dissipated without the need for heat sink components or other complex and costly materials. The Molex zSFP+ is ideal for applications requiring 25Gbps data rates for next-generation Ethernet and Fibre Channel applications. The system provides a drop-in replacement for existing zSFP designs (re-routing of thru-flow design may be necessary if light pipes are in the midesction).

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