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In Stock

RoHS

Mfr.	Mfr. No:	Qty	Ext Total

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212132-0002

Name: Molex 212132-0002
Brand: Molex
SKU: 538-212132-0002
Price: 0.17 USD
Availability: InStock

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Mouser No:

538-212132-0002

Mfr. No:

212132-0002

Mfr.:

Molex

Description:

Headers & Wire Housings Pico-EZMate Plus1.0 RecHsg LH 2Ckt

Datasheet:

212132-0002 Datasheet

ECAD Model:

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More Information

Learn more about Molex 212132-0002

In Stock: 84,756

Stock:: 84,756 Can Dispatch Immediately

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Factory Lead Time:: 10 Weeks Estimated factory production time for quantities greater than shown.

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Minimum: 1 Multiples: 1

Unit Price:

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Ext. Price:

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Est. Tariff:

Pricing (USD)

Qty.	Unit Price	Ext. Price
	$0.172	$0.17
	$0.161	$1.61
	$0.149	$3.73
	$0.143	$14.30
	$0.14	$560.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Wire Housings
Number of Positions:	2 Position
Pitch:	1 mm (0.039 in)
Number of Rows:	1 Row
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Series:	212132
Tradename:	Pico-EZmate Plus
Application:	Wire-to-Board, Signal
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Bulk
Brand:	Molex
Contact Material:	Copper Alloy
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	JP
Housing Gender:	Receptacle
Housing Material:	Polyamide (PA)
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	4000
Subcategory:	Headers & Wire Housings
Part # Aliases:	2121320002 02121320002

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Datasheet

212132-0002 Datasheet

Models

STP File (Zip)

Technical Resources

CNHTS:: 8547200000
TARIC:: 8547200000
USHTS:: 8538906000
ECCN:: EAR99

Pico-EZmate Plus 1.00mm-Pitch Connector System

The Molex Pico-EZmate Plus 1.00mm-Pitch Connector System delivers high performance in a low-profile height, improved withdrawal force, and a current rating of up to 2.8A. Features include polarisation keys to prevent mismating, a low-halogen polyamide material, and thicker housing sidewalls. The connectors are ideal for automated assembly processes in tight-spaced applications within the consumer, home appliance, data centre, mobile device and medical markets.