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501330-0300

Name: Molex 501330-0300
Brand: Molex
SKU: 538-501330-0300
Price: 0.32 USD
Availability: InStock

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Mouser No:

538-501330-0300

Mfr. No:

501330-0300

Mfr.:

Molex

Description:

Headers & Wire Housings 1.0 WtB 3Ckt Female Housing

Datasheet:

501330-0300 Datasheet

ECAD Model:

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More Information

Learn more about Molex 501330-0300

In Stock: 1,802

Stock:: 1,802

Can Dispatch Immediately

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On Order:: 12,000
Factory Lead Time:: 21

Weeks Estimated factory production time for quantities greater than shown.

Enter Quantity:

Minimum: 1 Multiples: 1

Unit Price:

$-.--

Ext. Price:

$-.--

Est. Tariff:

Pricing (USD)

Qty.	Unit Price	Ext. Price
	$0.324	$0.32
	$0.283	$2.83
	$0.251	$6.28
	$0.218	$21.80
	$0.193	$48.25
	$0.16	$160.00
	$0.15	$450.00
	$0.142	$710.00
	$0.136	$1,360.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Wire Housings
Type:	Receptacle Housing
Number of Positions:	3 Position
Pitch:	1 mm (0.039 in)
Number of Rows:	1 Row
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Contact Gender:	Socket (Female)
Series:	501330
Tradename:	Pico-Clasp
Application:	Wire-to-Board, Signal
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Bulk
Brand:	Molex
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	JP
Current Rating:	1 A
Housing Colour:	White
Housing Material:	Nylon
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	1000
Subcategory:	Headers & Wire Housings
Unit Weight:	27 mg

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Attributes selected: 0

Filter Document:

CNHTS:: 8547200000
TARIC:: 8547200090
CAHTS:: 8536690020
USHTS:: 8538906000
JPHTS:: 853669000
KRHTS:: 8536691000
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

Pico-Clasp™ Wire-to-Board Connectors

Molex Pico-Clasp™ Wire-to-Board Connectors are the smallest pitch (1.00mm) wire-to-board connectors with positive lock. Pico-Clasp 1.00mm pitch connectors come in single-row and dual-row configurations. The series offers friction and positive locks for various application needs. Pico-Clasp is designed for various connections in flat panel displays (FPD). This Molex connector system is also ideal for use in notebook PCs and other compact devices.

Signal Wire-to-Wire/Wire-to-Board Connectors

Molex Signal Wire-to-Wire/Wire-to-Board Connectors and Connector Systems feature a variety of wire-to-board signal connectors that offer design flexibility. Molex Signal WTW/WTB connectors and systems are ideal for personal computers and lighting, as well as automotive and industrial applications, depending on the model.

IllumiMate 1.0mm Pitch Connector System

Molex IllumiMate 1.0mm Pitch Wire-to-Board Connector System saves about 50% of space compared to IllumiMate 1.25 Connectors to meet the demands of thinner screen designs. Molex IllumiMate 1.00mm Connectors also offer lower voltage options than the IllumiMate 1.25 range to help achieve lower power consumption. IllumiMate 1.00mm Connectors feature positive and friction locks for secure latching, guide ribs to facilitate mating and prevent housing movement, front solder tabs for strong PCB retention, and a dual-contact terminal design for electrical contact assurance. The combination of small size and various circuit size and voltage options provide unique advantages and a single footprint design for any application that may include various models with different functionalities. These Molex wire-to-board connectors are ideal for use in a variety of markets and applications, including consumer electronics (LED TVs and mobile games), personal computers (desktop LED monitors, notebooks, and tablets), and medical (diagnostic and radiology equipment).

Miniaturization Solutions

Molex Miniaturization Solutions are ideal for a vast array of applications such as automotive, smart devices, mobile devices, and medical technology. These connectors provide space savings, high-density signals, and durability. The miniaturization of Molex connectors offers the benefit of fitting more components into smaller spaces, leading to increased functionality without the increased size or weight.