87715-9105

Molex
538-87715-9105
87715-9105

Mfr.:

Description:
PCI Express/PCI Connectors VERT THRU-HOLE 64P 15 plated

ECAD Model:
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In Stock: 709

Stock:
709
Can Dispatch Immediately
On Order:
3,360
Factory Lead Time:
15
Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$2.90 $2.90
$2.66 $26.60
$2.51 $62.75
$2.34 $234.00
$2.04 $510.00
$1.99 $995.00
$1.81 $1,810.00
$1.66 $2,788.80
$1.60 $8,064.00

Product Attribute Attribute Value Select Attribute
Molex
Product Category: PCI Express/PCI Connectors
RoHS:  
PCI Express
64 Position
Through Hole
Vertical
Through Hole
Tin
Gold
87715
Brand: Molex
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: CN
Current Rating: 1.1 A
Maximum Operating Temperature: + 85 C
Minimum Operating Temperature: - 55 C
Packaging: Tray
Product Type: PCI Express / PCI Connectors
Factory Pack Quantity: 1680
Subcategory: Card Edge Connectors
Voltage Rating: 50 VAC/DC
Part # Aliases: 0877159105
Unit Weight: 3.866 g
Products found:
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Attributes selected: 0

CNHTS:
8536901100
CAHTS:
8536690020
USHTS:
8536694040
JPHTS:
853669000
KRHTS:
8536691000
TARIC:
8536693000
MXHTS:
8536699999
BRHTS:
85366990
ECCN:
EAR99

PCI Express Edgecard Connectors

Molex PCI Express Edgecard Connectors offer a third-generation I/O architecture. PCI-SIG revised the PCI Express specifications from version 1.1 to version 2.0. This revision doubles the PCI Express interconnect bit rate from 2.5GT/s (gigatransfer per second) to 5GT/s per lane. PCI Express supports high-bandwidth applications and is also backward compatible with PCI Express 1.1 version products.

High-Speed Solutions

Molex High-Speed Solutions meet the most stringent high-speed performance requirements. The broad connector portfolio supports a wide range of data rates in multiple sizes and shapes. High-speed interconnect solutions provide the flexibility and scalability required to meet the demands of next-generation systems.