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90123-0103

Name: Molex 90123-0103
Brand: Molex
SKU: 538-90123-0103
Price: 0.44 USD
Availability: InStock

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Mouser No:

538-90123-0103

Mfr. No:

90123-0103

Mfr.:

Molex

Description:

Headers & Wire Housings 2.54MM CGRIDIII HSG 3P SR W/2POL BTTN

Datasheet:

90123-0103 Datasheet

ECAD Model:

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More Information

Learn more about Molex 90123-0103

In Stock: 16,056

Stock:: 16,056 Can Dispatch Immediately

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Factory Lead Time:: 40 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$0.449	$0.45
	$0.322	$3.22
	$0.294	$7.35
	$0.277	$27.70
	$0.238	$59.50
	$0.201	$201.00
	$0.198	$594.00
	$0.193	$965.00
	$0.188	$1,880.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Wire Housings
Type:	Receptacle Housing
Number of Positions:	3 Position
Pitch:	2.54 mm (0.1 in)
Number of Rows:	1 Row
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Contact Gender:	Socket (Female)
Series:	90123
Tradename:	C-Grid
Application:	Wire-to-Board, Signal
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Bulk
Brand:	Molex
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Flammability Rating:	UL 94 V-1
Housing Colour:	Black
Housing Material:	Polyphenylene Oxide (PPO)
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	1000
Subcategory:	Headers & Wire Housings
Part # Aliases:	0901230103
Unit Weight:	120 mg

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Datasheet

90123-0103 Datasheet

Models

RoHS Certificate (PDF)

CNHTS:: 8547200000
CAHTS:: 8536690020
USHTS:: 8538906000
JPHTS:: 853890000
KRHTS:: 8536691000
TARIC:: 8547200090
MXHTS:: 8538900100
BRHTS:: 85389090
ECCN:: EAR99

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3^rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.