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90156-0154

Name: Molex 90156-0154
Brand: Molex
SKU: 538-90156-0154
Price: 2.4 USD
Availability: InStock

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Mouser No:

538-90156-0154

Mfr. No:

90156-0154

Mfr.:

Molex

Description:

Headers & Wire Housings 2.54MM CGRIDIII HSG 14P SR CRIMP

Datasheet:

90156-0154 Datasheet

ECAD Model:

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More Information

Learn more about Molex 90156-0154

In Stock: 2,847

Stock:: 2,847 Can Dispatch Immediately

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Factory Lead Time:: 8 Weeks Estimated factory production time for quantities greater than shown.

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$2.40	$2.40
	$1.81	$18.10
	$1.59	$159.00
	$1.49	$372.50
	$1.20	$600.00
	$1.14	$1,140.00
	$1.09	$1,635.00
	$1.05	$4,725.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Molex
Product Category:	Headers & Wire Housings
RoHS:
Product:	Wire Housings
Type:	Receptacle Housing
Number of Positions:	14 Position
Pitch:	2.54 mm (0.1 in)
Number of Rows:	1 Row
Mounting Style:	Cable Mount / Free Hanging
Termination Style:	Crimp
Contact Gender:	Socket (Female)
Series:	90156
Tradename:	C-Grid
Application:	Wire-to-Board, Signal
Minimum Operating Temperature:	- 55 C
Maximum Operating Temperature:	+ 105 C
Packaging:	Bulk
Brand:	Molex
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	ID
Current Rating:	3 A
Housing Colour:	Black
Housing Material:	Polyphenylene Oxide (PPO)
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	1500
Subcategory:	Headers & Wire Housings
Part # Aliases:	0901560154
Unit Weight:	1.096 g

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Datasheet

90156-0154 Datasheet

Models

RoHS Certificate (PDF)

CNHTS:: 8538900000
CAHTS:: 8536690020
USHTS:: 8538906000
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536699099
MXHTS:: 8536699999
BRHTS:: 85366990
ECCN:: EAR99

C-Grid III™ Modular Interconnect Systems

Molex C-Grid III™ Modular Interconnect Systems are 3^rd generation 2.54mm pitch header and receptacle interconnect systems offering unique design features. These interconnect systems offer complete design flexibility and modular components that provide the widest range of electronic packaging alternatives. The C-Grid III interconnect systems are based on north/south contact orientation and combine three different termination techniques including solder tail, crimp, and insulation displacement. These interconnected systems are fully compatible with the industry-standard DIN41651 as well as the French norm HE-13/14.

C-Grid Connector System

Molex C-Grid Connector System is a dual row, wire-to-board system. The system includes vertical and right angle headers in breakaway, shrouded and dual-body styles, vertical and right angle receptacles, headers and receptacles for SMT applications, press-fit headers, and a 2-circuit shunt completes the C-Grid product line. Molex C-Grid Connector System has the ability to mate with SL and KK® products and is suitable for low power signal applications such as computers, medical instruments, and automotive controls.