MBMI7018SA1AE

Name: NXP MBMI7018SA1AE
Brand: NXP Semiconductors
SKU: 771-MBMI7018SA1AE
Price: 10.5 USD
Availability: InStock

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Mouser No:

771-MBMI7018SA1AE

Mfr. No:

MBMI7018SA1AE

Mfr.:

NXP Semiconductors

Description:

Battery Management 18-channel Battery Cell Controller for Energy Storage System (ESS) Applications

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

MBMI7018SA1AE Datasheet (PDF)

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In Stock: 148

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Factory Lead Time:: 18 Weeks Estimated factory production time for quantities greater than shown.

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Qty.	Unit Price	Ext. Price
	$10.50	$10.50
	$8.11	$81.10
	$7.74	$193.50
	$6.72	$672.00
	$5.79	$1,447.50
	$5.70	$6,384.00
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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	NXP
Product Category:	Battery Management
RoHS:
Product:	Battery-Cell Controller IC
Battery Type:	Lithium-ion
Output Voltage:	3.3 V, 5 V
Output Current:	300 uA
Operating Supply Voltage:	9 V to 90 V
Package/Case:	LQFP-64
Mounting Style:	SMD/SMT
Packaging:	Tray
Brand:	NXP Semiconductors
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Maximum Operating Temperature:	+ 60 C
Minimum Operating Temperature:	- 20 C
Moisture Sensitive:	Yes
Product Type:	Battery Management
Factory Pack Quantity:	160
Subcategory:	PMIC - Power Management ICs
Part # Aliases:	935464268557

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Datasheet

MBMI7018SA1AE Datasheet (PDF)

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CAHTS:: 8542310000
USHTS:: 8542310030
ECCN:: EAR99

BMI7018 18-Ch Li-Ion Battery Cell Controller ICs

NXP Semiconductors BMI7018 18-Channel Li-Ion Battery Cell Controller ICs are lithium-ion battery-cell controller ICs for use in industrial applications, such as energy storage systems (ESS) and uninterruptible power supply (UPS) systems. The BMI7018 ICs offer a Transport Protocol Link (TPL3 - proprietary isolated daisy chain protocol of NXP) and Serial Peripheral Interface (SPI) for communication with the host microcontroller unit (MCU). These devices support high-precision cell voltage and temperature measurements along with various cell voltage balancing strategies. Aside from an SPI interface to enable direct communication with the host MCU, the ICs provide alternatively a daisy chain communication interface that supports capacitive and inductive isolation between nodes.