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172-037-113R021

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Mouser No:

636-172-037-113R021

Mfr. No:

172-037-113R021

Mfr.:

NorComp

Description:

D-Sub Standard Connectors D-Sub Conn 37P M Dip Solder NICKEL

Datasheet:

172-037-113R021 Datasheet (PDF)

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More Information

Learn more about NorComp 172-037-113R021

Delivery Restriction:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	NorComp
Product Category:	D-Sub Standard Connectors
Delivery Restriction:	Mouser does not presently sell this product in your region.
RoHS:
Number of Positions:	37 Position
Contact Gender:	Pin (Male)
Termination Style:	Solder Cup
Mounting Style:	Panel
Mounting Angle:	Straight
Number of Rows:	2 Row
Gender:	Male
Contact Plating:	Gold
Type:	Plug
Shell Material:	Steel
Shell Plating:	Nickel
Filtered:	Unfiltered
Series:	172
Packaging:	Tray
Brand:	NorComp
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Product Type:	D-Sub Connectors - Standard Density
Factory Pack Quantity:	20
Subcategory:	D-Sub Connectors
Tradename:	M-SERIES
Voltage Rating:	500 VAC

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USHTS:: 8536694040
TARIC:: 8536693000
ECCN:: EAR99

D-Sub Standard Connectors

NorComp D-Sub Standard Connectors are available in cable and board mount options. The cable mount options include crimp, solder cup, and low profile IDC, and the board mount options include Dip Solder, Wire Wrap, High Profile, Right Angle, Surface Mount (SMT), and Press Fit. This comprehensive NorComp Standard Density D-Sub product is available in stamped, formed, and machined contact options.

SEAL-D® IP67 D-Sub Connectors

NorComp IP67 SEAL-D® D-Sub Connectors utilize a proprietary sealing technology, which maintains the same physical size and footprint as standard D-Sub products. This drop-in replacement eliminates the need to redesign enclosures and PC boards when implementing IP67 design upgrades and reduces space on new designs. The NorComp IP67 SEAL-D D-Sub Connectors are available in standard and high-density configurations, as well as 3 termination types. Ideal for electronics that are used outdoors, remote sensors, gauges, and data loggers that are exposed to the elements, and any electronics that are routinely subjected to wash down and short-term immersion.

SEAL-D® Connectors

NorComp SEAL-D® D-Sub Connectors feature a proprietary sealing technology that maintains the same physical size and footprint as standard D-Sub products. This drop-in replacement eliminates the need to redesign enclosures and PC boards when implementing IP-rated design upgrades and reduces space on designs. NorComp SEAL-D D-Sub Connectors are available in standard and high-density configurations in a range of termination types.

D-Sub Solutions

NorComp D-Sub Solutions offer a broad range of higher reliability D-Sub connectors, backshells, and hoods. NorComp's D-Sub product line is designed for applications that require a rugged, robust I/O connector system with various styles and mounting options. All are used in multiple industries, including computer, industrial, medical, and military markets.

Rugged Environment Certified (REC) Connectors

NorComp Rugged Environment Certified (REC) Connectors are ruggedized harsh-environment connector solutions that have been proven to withstand the most challenging environments. Rugged Environment Certified (REC) is an external testing certification certifying quality and performance. These connectors encompass D-sub and circular connectors that are available in standard, high-density, or mixed layout types. These connectors are reliable, cost-effective, provide ease of installation, and are ideal for use in many outdoor harsh environments including oil rigs, weather stations, and ruggedized industrial applications.

172 D-Sub Connectors

NorComp 172 D-Sub Connectors feature a 5A rated current with Nickel or Tin shell plating options. These connectors have nine to 50 positions, two or three rows, and straight or vertical mounting angles. The NorComp 172 D-Sub Connectors are ideal for use in communication, instrumentation, medical, computer/peripherals, commercial, test labs, and gaming applications.