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APF6-025-03.5-STL-06-0-S-TR

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Mouser No:

200-APF6253.5STL60ST

Mfr. No:

APF6-025-03.5-STL-06-0-S-TR

Mfr.:

Samtec

Description:

Board to Board & Mezzanine Connectors 0.635 mm Pitch AcceleRate HP High-Performance Array Socket

Lifecycle:

Factory Special Order:

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Datasheet:

APF6-025-03.5-STL-06-0-S-TR Datasheet (PDF)

ECAD Model:

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Samtec
Product Category:	Board to Board & Mezzanine Connectors
Product:	Socket Array
Number of Positions:	25 Position
Pitch:	0.635 mm (0.025 in)
Number of Rows:	6 Row
Termination Style:	Solder
Mounting Angle:	Vertical
Contact Plating:	Gold
Contact Material:	Copper
Housing Material:	Liquid Crystal Polymer (LCP)
Series:	APF6
Packaging:	Reel
Brand:	Samtec
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	US
Flammability Rating:	UL 94 V-0
Product Type:	Board to Board & Mezzanine Connectors
Factory Pack Quantity:	125
Subcategory:	Board to Board & Mezzanine Connectors
Tradename:	Accelerate HP

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Datasheet

APF6-025-03.5-STL-06-0-S-TR Datasheet (PDF)

56Gbps NRZ High-Speed Board-To-Board Connectors

Samtec 56Gbps Non-Return-to-Zero (NRZ) High-Speed Board-To-Board Connectors majorly include NovaRay^® Extreme Performance (EP) and AcceleRate^® High-Performance (HP) Arrays connector systems. These connectors are 0.80mm (0.0315") and 0.635mm (0.025") pitch solutions, rated for 56Gbps NRZ applications. The 56Gbps NRZ method is a binary code using low and high signal levels to represent 1/0 information of the digital logic signal. The NRZ system can only transmit 1-bit, such as 0 or 1, of information per signal symbol period. These connectors are well-suited for high-speed applications, including 5G networking, industrial, military/aerospace, test connectivity, medical, broadcast video, automotive, AI/machine learning, and instrumentation.

Flexible Stacking Connectors

Samtec Flex Stacking Board Connectors feature a large variety of board-to-board connectors with design flexibility. These Samtec board-to-board connector systems are available in a variety of pitches, densities, stack heights, orientations, and other standard or modified options, making it easy to find the right connector for any application. Flex-Stack options include one-piece, low profile pass-through, elevated, hermaphroditic, shrouded, coplanar, parallel, and perpendicular. Post heights are adjustable in increments of 0.005” (0.13mm).

APF6 & APM6 AcceleRate® High-Performance Terminals

Samtec APF6 and APM6 AcceleRate® High-Performance Terminals are 0.635mm pitch interconnects featuring 112Gbps PAM4 extreme performance and a flexible open-pin-field design. The APF6 and APM6 AcceleRate Terminals have a high-density 4-row design, with 10 to 100 positions in each row. These devices are ideal for space-constrained applications, with a low-profile 5mm height and a slim 5mm width.