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BGM260PB32VNA2

Name: Silicon Labs BGM260PB32VNA2
Brand: Silicon Labs
SKU: 634-BGM260PB32VNA2
Price: 10.73 USD
Availability: OutOfStock

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Mouser No:

634-BGM260PB32VNA2

Mfr. No:

BGM260PB32VNA2

Mfr.:

Silicon Labs

Description:

Bluetooth Modules - 802.15.1 Low Energy 5.4 Wireless Gecko Bluetooth Module

Lifecycle:

New At Mouser

Datasheet:

BGM260PB32VNA2 Datasheet (PDF)

ECAD Model:

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More Information

Learn more about Silicon Labs BGM260PB32VNA2

Availability

Stock:: 0

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Factory Lead Time:: 20 Weeks Estimated factory production time for quantities greater than shown.

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Unit Price:

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Ext. Price:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
	$10.73	$10.73
	$9.84	$98.40
	$9.18	$459.00
	$7.79	$779.00
	$7.43	$1,486.00
	$6.91	$3,455.00
	$6.66	$6,660.00

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	Silicon Labs
Product Category:	Bluetooth Modules - 802.15.1
RoHS:
Series:	BGM260P
Protocol:	Bluetooth v5.4
Class:	Class 2
Interface Type:	ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART
Output Power:	19.5 dBm
Data Rate:	2 Mb/s
Frequency:	2.4 GHz
Supply Voltage - Min:	1.8 V
Supply Voltage - Max:	3.8 V
Minimum Operating Temperature:	- 40 C
Maximum Operating Temperature:	+ 125 C
Packaging:	Cut Tape
Antenna:	Integrated, Chip
Brand:	Silicon Labs
Core:	32-bit ARM Cortex-M33
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Dimensions:	12.9 mm x 15 mm
Memory Size:	3.2 MB Flash, 512 kB RAM
Modulation Technique:	GFSK
Moisture Sensitive:	Yes
Mounting Style:	SMD/SMT
Operating Supply Voltage:	1.8 V to 3.8 V
Product:	Bluetooth Modules
Product Type:	Bluetooth Modules
Protocol - Bluetooth, BLE - 802.15.1:	Bluetooth LE
Sensitivity:	- 105.6 dBm
Factory Pack Quantity:	100
Subcategory:	Wireless & RF Modules
Supply Current Receiving:	4.5 mA
Supply Current Transmitting:	154.8 mA

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Attributes selected: 0

Filter Document:

USHTS:: 8517620090
JPHTS:: 851762090
TARIC:: 8517620000
ECCN:: 5A992.C

xGM260P Wireless Modules

Silicon Labs xGM260P Wireless Modules are 2.4GHz frequency devices that deliver excellent RF performance. The MGM260P modules are based on the EFR32MG26 System-on-Chips (SoCs) and support Bluetooth^®, Zigbee^®, Thread, and Matter protocols. These MGM260P modules feature Secure Vault® technology and support various advanced debugging and development tools. The BGM260P modules are based on the EFR32BG26 SoCs and support Bluetooth Low Energy (BLE) and Bluetooth mesh. These xGM260P wireless modules are ideal for use in light bulbs and designs that require extra PCB layout flexibility.