FS1406-1000-AS

TDK
810-FS1406-1000-AS
FS1406-1000-AS

Mfr.:

Description:
DC/DC Converters - SMD 1.00V uPOL 6A Power Module

Datasheet:
More Information
Learn more about TDK FS1406-1000-AS

In Stock: 406

Stock:
406 Can Dispatch Immediately
Factory Lead Time:
20 Weeks Estimated factory production time for quantities greater than shown.
Minimum: 1   Multiples: 1
Unit Price:
$-.--
Ext. Price:
$-.--
Est. Tariff:

Pricing (USD)

Qty. Unit Price
Ext. Price
$5.77 $5.77
$5.67 $28.35
$5.58 $55.80
$5.51 $137.75
$5.36 $268.00
$4.67 $467.00
Full Reel (Order in multiples of 250)
$4.22 $1,055.00

Alternative Packaging

Mfr. Part No.:
FS1406-1000-AL
Packaging:
Reel, Cut Tape
Availability:
In Stock
Price:
$7.60
Min:
1

Product Attribute Attribute Value Select Attribute
TDK
Product Category: DC/DC Converters - SMD
RoHS:  
Non-Isolated
1 Output
4.5 V
16 V
1 V
6 A
SMD-17 Module
3.3 mm (0.13 in)
3.3 mm (0.13 in)
1.5 mm (0.059 in)
Industrial
FS1406
Brand: TDK
Case Style: Open Frame
Country of Assembly: Not Available
Country of Diffusion: Not Available
Country of Origin: TW
Input Voltage: 4.5 V to 16 V
Maximum Operating Temperature: + 125 C
Minimum Operating Temperature: - 40 C
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Packaging: Reel
Packaging: Cut Tape
Product: Non-Isolated / PoL
Product Type: Non-Isolated DC-DC Converters
Factory Pack Quantity: 250
Subcategory: DC-DC Converters
Tradename: uPOL
Part # Aliases: FS1406-1000-AS -
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Attributes selected: 0

CAHTS:
8542390000
USHTS:
8504409580
TARIC:
8504409590
MXHTS:
8542399999
ECCN:
EAR99

μPOL™ DC-DC Power Modules

TDK μPOL™ DC-DC Power Modules are compact and highly integrated point-of-load (POL) converters. These modules are ideal for powering CPUs, MCUs, ASICs, FPGAs, DSPs and other advanced digital logic devices. The µPOL high current density power modules provide the high performance, fast load transient response and high accuracy voltage regulation required by these devices. These Micro-POL converters feature a chip-embedded power IC in a thermally enhanced semiconductor-embedded-in-substrate package.

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