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RoHS

Mfr.	Mfr. No:	Qty	Ext Total

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1-2483190-2

Name: TE Connectivity 1-2483190-2
Brand: TE Connectivity
SKU: 571-1-2483190-2
Price: 0.71 USD
Availability: InStock

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Mouser No:

571-1-2483190-2

Mfr. No:

1-2483190-2

Mfr.:

TE Connectivity

Description:

Headers & Wire Housings 0.8mm right angle WTB 12Pos

Lifecycle:

New Product:

New from this manufacturer.

Datasheet:

1-2483190-2 Datasheet

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Learn more about TE Connectivity 1-2483190-2

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10,500 Can Dispatch in 10 Days

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Minimum: 10500 Multiples: 10500

Unit Price:

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Ext. Price:

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Est. Tariff:

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Pricing (USD)

Qty.	Unit Price	Ext. Price
Full Reel (Order in multiples of 3500)
	$0.713	$7,486.50

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Product Attribute	Attribute Value	Select Attribute
Manufacturer:	TE Connectivity
Product Category:	Headers & Wire Housings
RoHS:
Product:	Headers
Number of Positions:	12 Position
Pitch:	0.8 mm (0.031 in)
Mounting Style:	PCB Mount
Termination Style:	Solder
Mounting Angle:	Right Angle
Contact Plating:	Gold
Application:	Industrial
Minimum Operating Temperature:	- 25 C
Maximum Operating Temperature:	+ 85 C
Packaging:	Reel
Brand:	TE Connectivity
Contact Material:	Phosphor Bronze
Country of Assembly:	Not Available
Country of Diffusion:	Not Available
Country of Origin:	CN
Current Rating:	1 A
Flammability Rating:	UL 94 V-0
Housing Colour:	Black
Housing Gender:	Receptacle
Housing Material:	Liquid Crystal Polymer (LCP)
Insulation Resistance:	100 MOhms
Product Type:	Headers & Wire Housings
Factory Pack Quantity:	3500
Subcategory:	Headers & Wire Housings
Voltage Rating:	30 VAC/DC

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Datasheet

1-2483190-2 Datasheet

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USHTS:: 8536694040
ECCN:: EAR99

0.8 mm Low-Profile IDC Connector System

TE Connectivity's (TE) 0.8mm Low-Profile IDC Connector System is designed for space-constrained applications where signal or low-power needs to be routed through a device. Features include a compact 0.8mm centerline, convenient insulation displacement contact (IDC) cable termination, and a space-saving, low-profile design that helps save PCB real estate. TE 0.8mm Low-Profile IDC Connector System is suitable for data communications, consumer devices, automotive environments, and the Internet of Things (IoT) applications.